Isingeniso:Ekuthuthukisweni kwesimanje kanye nesimanje of theukukhanyaimboni, imithombo yokukhanya ye-LED kanye ne-COB ngokungangabazeki amaparele amabili akhazimula kakhulu. Ngezinzuzo zabo eziyingqayizivele zobuchwepheshe, bakhuthaza ngokuhlanganyela inqubekelaphambili yemboni.Le ndatshana izodingida umehluko, izinzuzo, kanye nokubi phakathi kwemithombo yokukhanya ye-COB nama-LED, ihlole amathuba nezinselele ababhekana nazo endaweni yezimakethe zokukhanyisa zanamuhla, kanye nomthelela wazo ezinkambisweni zokuthuthukiswa kwezimboni zesikhathi esizayo.
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PukuvumaTubuchwepheshe: Tuyagxuma esuka kumayunithi ahlukene aye kumamojula adidiyelwe
Umthombo wokukhanya we-LED wendabuko
YendabukoUkukhanya kwe-LEDimithombo isebenzisa imodi yokupakisha ye-single-chip, ehlanganisa ama-chips e-LED, izintambo zegolide, abakaki, izimpushana ze-fluorescent, nama-colloid okupakisha. I-chip igxilwe ngaphansi kwesibambi senkomishi esikhanyayo nge-adhesive conductive, futhi intambo yegolide ixhuma i-electrode ye-chip nephinikhodi yesibambi. Impushana ye-fluorescent ixubene ne-silicone ukumboza ubuso be-chip ukuze kuguqulwe i-spectral.
Le ndlela yokupakisha idale amafomu ahlukahlukene njengokufakwa okuqondile kanye nokukhwezwa kwendawo, kodwa empeleni iyinhlanganisela ephindaphindiwe yamayunithi azimele akhipha ukukhanya, njengamaparele ahlakazekile adinga ukuxhunywa ngokucophelela ochungechungeni ukuze akhanye. Kodwa-ke, lapho kwakhiwa umthombo wokukhanya wezinga elikhulu, ubunkimbinkimbi besistimu yokubona bukhula ngokuphawulekayo, njengokwakha isakhiwo esihle esidinga abantu abaningi kanye nezinsiza ezibonakalayo ukuze kuhlanganiswe futhi kuhlanganiswe isitini ngasinye netshe.
Umthombo wokukhanya we-COB
COB ukukhanyaimithombo igqekeza ipharadigm yokupakisha evamile futhi isebenzise ubuchwepheshe be-multi chip direct bonding ukuze ibophe ngokuqondile amashumi ezinkulungwaneni zama-chips e-LED kumabhodi esekethe asekelwe ensimbi noma ama-ceramic substrates.Ama-chips axhunywe ngogesi ngezintambo eziphakeme kakhulu, futhi indawo ekhanyayo ekhanyayo yenziwa ngokumboza lonke ungqimba lwejeli le-silicon eliqukethe izimpushana ze-fluorescent ezifana ne-ambering powder. igebe elibonakalayo phakathi kwama-LED ngamanye kanye nokuzuza ukwakheka ngokubambisana kwe-optics kanye ne-thermodynamics.
Isibonelo, i-Lumileds LUXION COB isebenzisa ubuchwepheshe be-eutectic soldering ukuhlanganisa ama-chips angu-121 0.5W ku-substrate eyindilinga enobubanzi obungu-19mm, ngamandla esewonke angu-60W. Isikhala se-chip sicindezelwe sibe ngu-0.3mm, futhi ngosizo lwe-cavity ekhethekile ekhanyayo, ukufana kokusabalalisa ukukhanya kudlula i-90%. Lokhu kuhlanganiswa okuhlanganisiwe akugcini nje ngokwenza lula inqubo yokukhiqiza, kodwa futhi kwakha uhlobo olusha "lomthombo wokukhanya njengemojula", okuhlinzeka ngesisekelo soguqukoukukhanyaukuklama, njengokuhlinzeka ngamamojula amahle enziwe ngaphambili abaklami bokukhanyisa, kuthuthukisa kakhulu ukusebenza kahle kokuklama nokukhiqiza.
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Izici ze-Optical:Uguquko kusukaukukhanya kwephuzuumthombo kuya emthonjeni wokukhanya ongaphezulu
I-LED eyodwa
I-LED eyodwa iwumthombo wokukhanya we-Lambertian, ekhipha ukukhanya nge-engeli engaba ngu-120 °, kodwa ukukhanya kokukhanya kubonisa ijika lephiko lelulwane elincipha kakhulu phakathi nendawo, njengenkanyezi ekhazimulayo, elikhanya ngokugqamile kodwa elihlakazekile futhi lingahlelekile. Ukuhlangana neukukhanyaizidingo, kuyadingeka ukulungisa kabusha ijika lokusabalalisa ukukhanya ngokusebenzisa idizayini yesibili yokubona.
Ukusetshenziswa kwamalensi e-TIR ohlelweni lwelensi kungacindezela i-engeli yokukhipha ibe ngu-30 °, kodwa ukulahlekelwa ukusebenza kahle kokukhanya kungafinyelela ku-15% -20%; Isibonisi se-parabolic kuhlelo lokubonisa singathuthukisa ukukhanya okumaphakathi, kodwa sizokhiqiza amabala okukhanya asobala; Uma uhlanganisa ama-LED amaningi, kuyadingeka ukugcina isikhala esanele ukugwema ukuhluka kombala, okungase kwandise ukushuba kwesibani. Kufana nokuzama ukuhlanganisa isithombe esiphelele esinezinkanyezi esibhakabhakeni ebusuku, kodwa kuhlale kunzima ukugwema amaphutha nezithunzi.
I-Integrated Architecture COB
Isakhiwo esihlanganisiwe se-COB ngokwemvelo sinezimpawu zendawoukukhanyaumthombo, njengomthala okhazimulayo onokukhanya okufanayo nokukhanya okuthambile.Ukuhlelwa kwe-chip eminyene eminingi kuqeda izindawo ezimnyama, kuhlanganiswe nobuchwepheshe be-lens array micro, kungafinyelela ukufana kokukhanya>85% phakathi kwebanga elingu-5m; Ngokuqinisa i-substrate surface, i-engeli ekhiphayo inganwetshwa ibe ngu-180 °, inciphise inkomba yokuxhopha (UGR) ibe ngaphansi kuka-19; Ngaphansi kokushintshashintsha okukhanyayo okufanayo, ukunwetshwa kokubona kwe-COB kwehliswe ngo-40% uma kuqhathaniswa nezinhlaka ze-LED, okwenza kube lula ukwakheka kokusabalalisa ukukhanya.Kumnyuziyamu.ukukhanyaindawo, ithrekhi ye-ERCO's COBizibanifinyelela isilinganiso sokukhanya esingu-50:1 ebangeni le-projection lamamitha angu-0.5 ngokusebenzisa amalensi amahhala, ukuxazulula ngokuphelele ukungqubuzana phakathi kokukhanyisa okufanayo nokugqamisa amaphuzu abalulekile.
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Isixazululo sokuphatha okushisayo:emisha kusukela ekulahlekeni kokushisa kwendawo kuya ekuqhutshweni kokushisa kwezinga lesistimu
Umthombo wokukhanya we-LED wendabuko
Ama-LED endabuko athatha indlela yokuqhuba emazingeni amane "yesekela ungqimba oluqinile lwe-PCB", enokwakheka okuyinkimbinkimbi kokumelana nokushisa, okufana nomzila omazombezombe, ovimbela ukushabalala ngokushesha kokushisa. Mayelana nokumelana nokushisa kwe-interface, kukhona ukumelana nokushisa kokuxhumana okungu-0.5-1.0 ℃/W phakathi kwe-chip nobakaki; Ngokuphathelene nokumelana nokushisa kwezinto ezibonakalayo, i-thermal conductivity yebhodi le-FR-4 kuphela i-0.3W / m · K, okuba ibhodlela lokukhipha ukushisa; Ngaphansi komphumela okhulayo, izindawo ezishisayo zendawo zingakhuphula izinga lokushisa lendawo ngo-20-30 ℃ uma ama-LED amaningi ehlanganiswa.
Idatha yokuhlola ibonisa ukuthi uma izinga lokushisa le-ambient lifinyelela ku-50 ℃, izinga lokubola kokukhanya kwe-SMD LED lishesha ngokuphindwe kathathu kunalelo lendawo engu-25 ℃, futhi isikhathi sokuphila sifinyezwa sibe ku-60% wezinga le-L70. Njengokuchayeka isikhathi eside elangeni elishisayo, ukusebenza nokuphila kweUkukhanya kwe-LEDumthombo uzoncishiswa kakhulu.
Umthombo wokukhanya we-COB
I-COB yamukela ukwakhiwa kwe-conduction enamazinga amathathu "ye-chip substrate heat sink", ifinyelela izinga eliphezulu lokuphatha okushisayo, njengokubeka umgwaqo omkhulu noyisicaba we.ukukhanyaimithombo, okuvumela ukushisa kuqhutshwe ngokushesha futhi kuhlakazwe. Ngokuphathelene nokusha kwe-substrate, ukuqhutshwa kokushisa kwe-aluminium substrate kufinyelela ku-2.0W/m · K, kanti leyo ye-aluminium nitride ceramic substrate ifinyelela ku-180W/m · K; Mayelana nomklamo wokushisa ofanayo, isendlalelo sokushisa esifanayo sibekwe ngaphansi kwe-chip array ukuze kulawulwe umehluko wokushisa ngaphakathi ± 2 ℃; Iphinde ihambisane nokupholisa okuwuketshezi, okunamandla okukhipha ukushisa afika ku-100W/cm ² lapho i-substrate ihlangana nepuleti lokupholisa eliwuketshezi.
Ekusetshenzisweni kwezibani zangaphambili zemoto, umthombo wokukhanya we-Osram COB usebenzisa idizayini yokuhlukanisa i-thermoelectric ukuzinzisa izinga lokushisa lendawo engaphansi kuka-85 ℃, ehlangabezana nezidingo zokuthembeka kwezindinganiso zezimoto ze-AEC-Q102, nempilo yokuphila engaphezu kwamahora angu-50000. Njengokushayela ngesivinini esiphezulu, kusengakwazi ukunikeza ukuzinza futhiukukhanya okuthembekilekubashayeli, ukuqinisekisa ukuphepha kokushayela.
Ithathwe ku-Lightingchina.com
Isikhathi sokuthumela: Apr-30-2025